Buffer overflow in Qualcomm products - CVE-2025-27071

Vulnerability identifier: #VU114610

CSH Severity: Medium

CVSS v4: 6.9 [CVSS:4.0/AV:N/AC:L/AT:N/PR:N/UI:N/VC:L/VI:L/VA:L/SC:N/SI:N/SA:N]

CVE-ID: CVE-2025-27071

CWE-ID: CWE-120

Exploitation vector: Remote access

Exploit availability: No public exploit available

The vulnerability allows a remote attacker to read and manipulate data.

The vulnerability exists due to improper input validation in Powerline Communication Firmware. A remote attacker can read and manipulate data.

WCN3660B
SW5100
SW5100P
SXR2230P
SXR2250P
WCD9380
WCD9385
WCN3620
Snapdragon XR2 5G Platform
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8835
FastConnect 6900
FastConnect 7800
QCA6391
QCA6426
QCA6436
QSM8250
SD865 5G
FastConnect 6800
Snapdragon 429 Mobile Platform
Snapdragon 8 Gen 1 Mobile Platform
Snapdragon 865 5G Mobile Platform
Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
Snapdragon 870 5G Mobile Platform (SM8250-AC)
Snapdragon W5+ Gen 1 Wearable Platform
Snapdragon X55 5G Modem-RF System
SXR2130
WSA8832
SDX55
SDM429W

Install security update from vendor's website.

• https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html

• Multiple vulnerabilities in Qualcomm chipsets (August 2025)