#VU76872 Buffer overflow in Qualcomm products - CVE-2022-33224

Vulnerability identifier: #VU76872

Vulnerability risk: Low

CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:H/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear

CVE-ID: CVE-2022-33224

CWE-ID: CWE-120

Exploitation vector: Local access

Exploit availability: No public exploit available

Vulnerable software:
AQT1000
FastConnect 6200
FastConnect 6900
FastConnect 7800
QAM8255P
QCA6420
QCA6430
QCA6595AU
QCA6696
QCA6698AQ
QCA6797AQ
SA6145P
SA6150P
SA8145P
SA8150P
SA8155P
SA8195P
SA8255P
Snapdragon 8 Gen 1 Mobile Platform
Snapdragon 855 Mobile Platform
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon 888 5G Mobile Platform
Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
Snapdragon W5+ Gen 1 Wearable Platform
Snapdragon Wear 4100+ Platform
SW5100
SW5100P
WCD9341
WCD9380
WCD9385
WCN3610
WCN3660B
WCN3680B
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8835
QCA6574AU
QCS8155
SA6155P
SD855

Software vendor:
Qualcomm

The vulnerability allows a local privileged application to execute arbitrary code.

The vulnerability exists due to improper input validation in Core. A local privileged application can execute arbitrary code.

Install security update from vendor's website.

• https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2023-bulletin.html