Buffer overflow in Qualcomm products - CVE-2023-21635

 

Buffer overflow in Qualcomm products - CVE-2023-21635

Published: July 3, 2023


Vulnerability identifier: #VU77858
CSH Severity: Low
CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:H/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear
CVE-ID: CVE-2023-21635
CWE-ID: CWE-120
Exploitation vector: Local access
Exploit availability: No public exploit available
Vulnerable software:
AQT1000
CSRB31024
FastConnect 6200
FastConnect 6800
FastConnect 6900
QCA6391
QCA6420
QCA6426
QCA6430
QCA6436
QCA6564
QCA6564AU
QCA6574A
QCA6595AU
QCA6696
SA6145P
SA6150P
SA8145P
SA8150P
SA8155P
SA8195P
SD865 5G
Snapdragon 855 Mobile Platform
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon 865 5G Mobile Platform
Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
Snapdragon 870 5G Mobile Platform (SM8250-AC)
Snapdragon W5+ Gen 1 Wearable Platform
Snapdragon Wear 4100+ Platform
Snapdragon X55 5G Modem-RF System
Snapdragon XR2 5G Platform
Snapdragon Auto 4G Modem
SW5100
SW5100P
WCD9341
WCD9380
WCN3610
WCN3660B
WCN3680B
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8835
QCA6574AU
SA6155P
SD855
SXR2130
Software vendor:
Qualcomm

Description

The vulnerability allows a local privileged application to execute arbitrary code.

The vulnerability exists due to improper input validation in Data Network Stack & Connectivity. A local privileged application can execute arbitrary code.


Remediation

Install security update from vendor's website.

External links