Buffer overflow in Qualcomm products - CVE-2023-21639
Published: July 3, 2023
Vulnerability identifier: #VU77861
CSH Severity: Low
CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:H/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear
CVE-ID: CVE-2023-21639
CWE-ID: CWE-120
Exploitation vector: Local access
Exploit availability:
No public exploit available
Vulnerable software:
AQT1000
FastConnect 6200
QCA6420
QCA6430
SA4150P
SA4155P
SA8155P
SA8195P
Snapdragon 855 Mobile Platform
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon W5+ Gen 1 Wearable Platform
SW5100
SW5100P
WCD9341
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8835
SA6155P
SD855
AQT1000
FastConnect 6200
QCA6420
QCA6430
SA4150P
SA4155P
SA8155P
SA8195P
Snapdragon 855 Mobile Platform
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon W5+ Gen 1 Wearable Platform
SW5100
SW5100P
WCD9341
WCN3980
WCN3988
WSA8810
WSA8815
WSA8830
WSA8835
SA6155P
SD855
Software vendor:
Qualcomm
Qualcomm
Description
The vulnerability allows a local privileged application to execute arbitrary code.
The vulnerability exists due to improper input validation in Audio. A local privileged application can execute arbitrary code.
Remediation
Install security update from vendor's website.