Buffer overflow in Qualcomm products - CVE-2023-28562

Vulnerability identifier: #VU80356

CSH Severity: High

CVSS v4: 9.3 [CVSS:4.0/AV:N/AC:L/AT:N/PR:N/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N]

CVE-ID: CVE-2023-28562

CWE-ID: CWE-120

Exploitation vector: Remote access

Exploit availability: No public exploit available

The vulnerability allows a remote attacker to execute arbitrary code.

The vulnerability exists due to improper input validation in QESL. A remote attacker can execute arbitrary code.

AB)
Vision Intelligence 400 Platform
Snapdragon X55 5G Modem-RF System
Snapdragon X50 5G Modem-RF System
Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA
Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC
AF) "Poipu Pro"
Snapdragon 8cx Compute Platform (SC8180XP-AC
WCD9326
Snapdragon 8cx Compute Platform (SC8180X-AA
Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite"
Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite"
Snapdragon 855+/860 Mobile Platform (SM8150-AC)
Snapdragon 855 Mobile Platform
Snapdragon 768G 5G Mobile Platform (SM7250-AC)
WCN3910
WSA8835
WSA8830
WSA8815
WSA8810
WCN3990
WCN3988
WCN3980
WCN3950
Snapdragon 765G 5G Mobile Platform (SM7250-AB)
WCD9385
WCD9380
WCD9375
WCD9370
WCD9341
WCD9340
WCD9335
QCS610
SM6250
SM4125
SD662
SD460
SC8180X+SDX55
SM6250P
QCS410
QCN7606
QCA6430
QCA6420
QCA6391
FastConnect 6800
FastConnect 6200
AQT1000
SM7250P
Snapdragon 460 Mobile Platform
Snapdragon 480 5G Mobile Platform
Snapdragon 480+ 5G Mobile Platform (SM4350-AC)
Snapdragon 662 Mobile Platform
Snapdragon 675 Mobile Platform
Snapdragon 678 Mobile Platform (SM6150-AC)
Snapdragon 690 5G Mobile Platform
Snapdragon 695 5G Mobile Platform
Snapdragon 720G Mobile Platform
Snapdragon 730 Mobile Platform (SM7150-AA)
Snapdragon 730G Mobile Platform (SM7150-AB)
Snapdragon 732G Mobile Platform (SM7150-AC)
Snapdragon 750G 5G Mobile Platform
Snapdragon 765 5G Mobile Platform (SM7250-AA)
SDX55
SD855
SD730

Install security update from vendor's website.

• https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2023-bulletin.html

• Multiple vulnerabilities in Qualcomm chipsets