Memory corruption in Linux kernel - CVE-2016-2063
Published: August 8, 2016 / Updated: August 6, 2020
Linux kernel
Detailed vulnerability description
The vulnerability allows a local user to execute arbitrary code.
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.