#VU74332 Integer underflow in Qualcomm products - CVE-2023-21630

Vulnerability identifier: #VU74332

Vulnerability risk: Low

CVSSv4.0: CVSS:4.0/AV:L/AC:L/AT:N/PR:L/UI:N/VC:H/VI:H/VA:H/SC:N/SI:N/SA:N/E:U/U:Clear

CVE-ID: CVE-2023-21630

CWE-ID: CWE-191

Exploitation vector: Local access

Exploit availability: No public exploit available

Vulnerable software:
FastConnect 6700
FastConnect 6900
FastConnect 7800
QCA6391
QCA6574
QCA6574A
QCA6595AU
QCA6696
SA8155P
SA8195P
SD 8 Gen1 5G
SD778G
SG4150P
SM7315
SM7325P
Snapdragon 680 4G Mobile Platform
Snapdragon 685 4G Mobile Platform (SM6225-AD)
Snapdragon 778G 5G Mobile Platform
Snapdragon 778G+ 5G Mobile Platform (SM7325-AE)
Snapdragon 780G 5G Mobile Platform
Snapdragon 782G Mobile Platform (SM7325-AF)
Snapdragon 8 Gen 1 Mobile Platform
Snapdragon 888 5G Mobile Platform
Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
SW5100
SW5100P
WCD9370
WCD9375
WCD9380
WCD9385
WCN3950
WCN3980
WCN3988
WCN6740
WSA8810
WSA8830
WSA8835
QCA6574AU
SA6155P
SD888

Software vendor:
Qualcomm

The vulnerability allows a local application to execute arbitrary code.

The vulnerability exists due to improper input validation in Multimedia Framework. A local application can execute arbitrary code.

Install security update from vendor's website.

• https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2023-bulletin.html